12 Mar Ranovus announces a strategic collaboration with IBM, TE Connectivity and Senko Advanced Components for design and delivery of multi-vendor Co-Packaged Optics solutions for Data Centers
Posted at 18:21h
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The Ranovus Odin™ 32 Co-Packaged Optics configuration for 51.2T Ethernet Switch application Ranovus Odin™ 32 Co-Packaged Optics solution leverages this partnership IBM will provide optical interconnect technologies that enable automated and scalable assembly for co-packaged optics TE will demonstrate its CP fine pitch socket technology combined with thermal...
