Careers

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity.  RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures.  We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation.  Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking a Senior Process Engineer to support NPI and Manufacturing Processes.

As a successful candidate, you will be working as the Photonic/ASIC Components integrator, working with Photonics, High Speed ASIC, Laser design teams and Ranovus’ CMs to define best in class optimal assembly processes for high volume Optical Engine (Module) manufacturing, targeted for data center applications. In conjunction with the project team, your role will be to support the micro-assembly process development (and manufacturing work instructions) during all phases of the project development (i.e. During NPI & Production Phase). Specifically, you will work on improvement and optimization of Silicon integrated photonic devices manufacturing & assembly processes.

Responsibilities generally include:

• Support and own the complete assembly process flow of the OE (Module) product:
• Passive optical and mechanical/packaging assembly sequences
• Part placement, adhesive dispense, adhesives curing parameters, metrology
• Material and sub-components management (including supplier audit)
• Active optical alignment processes
• Work on related wafer dicing processes
• Ensure reliability parameters are understood and addressed for the assembly process (de-risked as required for sub-assemblies)
• Work in conjunction with Ranovus’ Design teams & Contract Manufacturing Partners to develop, improve and optimize assembly processes to support high volume production. Analyze, track, evaluate quality of the assemblies coming from the CMs.
• Work with CMs in acceptance and commissioning process of future micro assembly machine to support product ramp
• Work with CMs to ensure processes for wafer level testing, and other assembly test steps are well defined, with optimized processes
• Monitor process data continuously, report on yield, throughput, defect rates, root cause analysis of defects, etc.

Required skills and experience include:

• Experience with Photonic, Laser, and ASIC components and micro-assembly;
• Experience in flip chip, chip on chip die attachment (on wafer), fiber attachment processes;
• 5-10 years of solid experience in related work;
• Excellent ability to solve technical, scientific and experimental problems;
• Excellent teamwork and communication skills;

Required education:

A bachelor (or desirably post graduate degree) in a relevant field: Electronics, Optics, Physics or equivalent studies.

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity.  RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures.  We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation.  Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking a Senior Hardware Design Engineer to join our R&D team in Ottawa.

Responsibilities generally include:

• Provide input to HW design architecture
• Conduct peer design reviews
• Aid in definition of circuit pack functional requirements
• Aid in Component engineering including selection, coding and review.
• Capture circuit level schematics
• Design Simulation
• Develop Stackups
• Manage PCB layout resources
• Work with high-speed RF transmission lines
• Bring up, debug and characterization of designs
• Author, maintain and contribute to design documentation including:
  • Product System Requirements,
  • Functional Specifications,
  • Hardware Design Specifications,
  • Verification Test Plans,
  • ECO Documentation and Design Release

Requirements:

• Bachelors Degree in Electrical Engineering or equivalent.
• A minimum of 7+ years of relevant experience in progressive roles.
• Board level design experience including:
  • High-speed digital circuits,
  • Analog circuits,
  • Power supply design,
  • Processors and microcontrollers,
  • Clock distribution,
  • FPGAs
• Experience designing with Thermal management
• Experience in EMI/EMC Compliance
• Experience in Schematic Capture tools (Cadence)
• Experience with PCB Layout Design Tools (Cadence Allegro)
• Experience with signal integrity analysis
• Experience with HW tracking and testing
• Experience with Lab Characterization tools:
• Oscilloscopes, DVM, Spectrum Analyzers, Optical test equipment
• Experience in a lab environment including trouble shooting issues
• Proven self-starter and team player