Careers

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity.  RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures.  We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation.  Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking a Semiconductor Laser Designer to contribute to our growth.

As a successful candidate, you will be a key member of our photonics development team and responsible for the design and development of next generation laser sources for Silicon Photonics applications. You will be working in a fast-paced environment where your skillset will be utilized and further developed. Based in Ottawa, you will be working with a variety of experts locally and around the world.

Responsibilities generally include:

• Design, simulation, testing and analysis of semiconductor lasers
  • Design and simulation using state-of-the-art simulation software
  • Develop and maintain design and requirements documentation
  • Define fabrication process
  • Mask layout
  • Data analysis
  • Failure analysis

Candidate should be experienced with:

• Simulations of active photonic devices

• Computer-aided design and layout of lithographic masks corresponding to various process steps in the fabrication of active photonic devices

• Optoelectronic device characterization and testing
• Analysis of active photonic devices
• Design and assembly of optical metrology set ups
• Hands-on lab skills in laser optical characterization, verification and testing

Desirable skills include:

• Simulations of active photonic devices
• Computer-aided design and layout of lithographic masks corresponding to various process steps in the fabrication of active photonic devices
• Optoelectronic device characterization and testing
• Analysis of active photonic devices
• Design and assembly of optical metrology set ups
• Hands-on lab skills in laser optical characterization, verification and testing

Required education:

• Ph.D. in Electrical Engineering, Photonics or a related discipline with emphasis on III-V optoelectronic devices

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity.  RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures.  We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation.  Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking a Senior Process Engineer to support NPI and Manufacturing Processes.

As a successful candidate, you will be working as the Photonic/ASIC Components integrator, working with Photonics, High Speed ASIC, Laser design teams and Ranovus’ CMs to define best in class optimal assembly processes for high volume Optical Engine (Module) manufacturing, targeted for data center applications. In conjunction with the project team, your role will be to support the micro-assembly process development (and manufacturing work instructions) during all phases of the project development (i.e. During NPI & Production Phase). Specifically, you will work on improvement and optimization of Silicon integrated photonic devices manufacturing & assembly processes.

Responsibilities generally include:

• Support and own the complete assembly process flow of the OE (Module) product:
• Passive optical and mechanical/packaging assembly sequences
• Part placement, adhesive dispense, adhesives curing parameters, metrology
• Material and sub-components management (including supplier audit)
• Active optical alignment processes
• Work on related wafer dicing processes
• Ensure reliability parameters are understood and addressed for the assembly process (de-risked as required for sub-assemblies)
• Work in conjunction with Ranovus’ Design teams & Contract Manufacturing Partners to develop, improve and optimize assembly processes to support high volume production. Analyze, track, evaluate quality of the assemblies coming from the CMs.
• Work with CMs in acceptance and commissioning process of future micro assembly machine to support product ramp
• Work with CMs to ensure processes for wafer level testing, and other assembly test steps are well defined, with optimized processes
• Monitor process data continuously, report on yield, throughput, defect rates, root cause analysis of defects, etc.

Required skills and experience include:

• Experience with Photonic, Laser, and ASIC components and micro-assembly;
• Experience in flip chip, chip on chip die attachment (on wafer), fiber attachment processes;
• 5-10 years of solid experience in related work;
• Excellent ability to solve technical, scientific and experimental problems;
• Excellent teamwork and communication skills;

Required education:

A bachelor (or desirably post graduate degree) in a relevant field: Electronics, Optics, Physics or equivalent studies.

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity. RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures. We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation. Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking a Senior Wafer Test Engineer to contribute to our growth. As the successful candidate, you will perform in a multi-disciplinary field requiring knowledge of semiconductor fab processes, RF and photonic circuits testing, test engineering, semiconductor wafer probers, and various probe technologies to combine electrical and optical testing.

This position is responsible for implementation of new wafer probe technologies and capabilities used for production and engineering wafer sort solutions. You will develop or modify test programs, define experiments and use statistical data analysis to study new probe technologies and subsequently develop / define operating criteria to be used for production probe requirements.

This position will interface with Design, Product Engineering, Quality and Manufacturing in delivering the highest quality probe & test solutions. You will be an expert in semiconductor wafer probe and test processes while employing mature engineering methods to make decisions and solve problems. You are a demonstrated self-starter and enjoy working in a fast-paced environment while maintaining a sense of commitment and flexibility to project needs. The assigned tasks will be diverse in nature which requires exceptional organization skills, innovation and high attention to detail.

Responsibilities include

• Define and drive implementation of wafer probe test processes
• Design and build automated test platforms to increase throughput for product development
• System integration of instruments and optics for opto-electronic wafer probers
• Define and specify probe card concepts to test monolithic integrated EPIC
• Identify best in class partners for on-wafer probing and drive selection of related equipment, particularly best suited probe stations
• Work with selected CM on optimization of wafer level production testing with the target to transfer test ownership to the CM
• Provide mentorship and training to junior engineers
• Serve as a liaison between manufacturing and engineering teams.
• Review methods and procedures, provide ideas for continuous improvement and exceptional quality to customers
• Review product requirements with test engineering team to ensure compatibility of selected probe methods
• Collaborate with EPIC designers to specify the test methodologies to enable electrical-optical test
• Partner with engineering staff to define and implement detailed testability requirements (DFT)
• Test methodology developed must scale up to screen die on wafer-level for high-volume manufacturing
• Write and modify test program as required
• Create procedural documents for new probe technologies and capabilities

Skills and experience

• +5 years of experience in testing integrated circuits on wafer level
• Hands-on knowledge of production wafer probers
• Hands on experience with optical and electrical test and measurement equipment
• Experience in developing test and measurement solutions for electrical and optical components
• Experience with digital and mixed signal IC testing
• Experience with RF and photonic IC testing
• Good understanding of electronics, and ability to read electrical schematics and technical documents
• Knowledge of data analysis and statistics, experience with Gauge R&R and SPC (StatisticalProcess Control) is a plus
• Strong technical writing and communication skills
• Team player with a strong sense of urgency to meet product requirements on schedule
• Proactive and self-motivated