Careers

Ranovus is seeking a Senior Product Engineer.  Reporting to the Vice President Operations, the successful candidate shall act as the technical prime for the Company’s products in manufacture.  Working closely with our R&D team, Process Engineering and our manufacturing partners, who have responsibility for developing and maintaining manufacturing equipment and capability, the Product Engineer shall act as the lead for pulling new products from R&D and work with the various parties to plan and action the transfer to our contract manufacturer (CM) and then maintain them in production.

This position requires a significant amount of travel to support Ranovus products at our contract manufacturing partner, and through our supply chain.  Specific responsibilities include,

Product Engineering

• Design authority for Ranovus products in manufacture
• Act as first line failure analysis and develop fault-finding algorithms for CM engineers
• Work with R&D and the Operations team to define production requirements and specifications in terms of process and test
• Work with the combined team to develop and deliver training programs for CM operators and engineers
• Work with the combined team to develop and maintain process and assembly tools in manufacture
• Manage and track product yield and develop detail product cost reduction plan according to targets, and track performance to plan
• Work with Test Engineering to create and manage automated analysis tools and key performance indicators (KPIs)
• BOM management of the products in mass production
• Responsible for the development of the packaging materials for products and associated recycling programs
• Work with PLM team on product customization
• Technical support to Quality and Sales organizations

Lifecycle Management

• Manage the product life cycle from product launch to mass production
• Review design for manufacturability (DFM)
• Review and update PFMEA
• Be responsible for the management and assessment of RMAs

Cross-functional Communications

• Interface with remote design teams and Application Engineering teams
• Support contract manufacturers
• Support sales teams and customers

Production Testing and Planning

• Define and verify production test requirements (PVT)
• Drive pilot builds and production forecasts into manufacturing line

Required Qualifications

This position requires a candidate with a strong, demonstrated record in the development and manufacture of advanced optoelectronic modules and devices in a telecom or Datacom environment.  This position will involve a higher than average level of travel (estimated at around 33%) to support the products during transfer to the CM and maintain the product in manufacture.

Skills and Experience

• A minimum of a Bachelor’s degree in a relevant discipline and 5+ years product experience in the design, manufacture or test of optoelectronic products
• Solid understanding of the principles and theory of optical devices such as lasers, modulators, detectors, optical sub-assemblies and transceivers
• Knowledge and experience of the production processes related to the manufacture of optoelectronic devices
• Excellent organisational and project management skills
• Understanding of Product Lifecycle Management
• Demonstrated track record of launching complex optoelectronic module products to market
• Problem solving and the ability to solve technical issues in a high pressure environment and resolve issues locally and remotely
• Experience working in a global marketplace
• Experience interacting with multi-functional, multi-locational teams
• Good written and oral communication skills
• Strong computer and analytical skills, including database management and data analysis tools

Advanced Optoelectronic Packaging

The Advanced Optoelectronic Packaging Design group within Ranovus, represents one of the key elements of overall product development for next generation all optical datacenter networks.  We are looking for an experienced Optical Process Engineer to work within a multi-disciplinary packaging team to develop state of the art optoelectronic products.  The process engineer will work closely with mechanical, RF, and optical engineers, within the packaging team to successfully develop and implement advanced micro/optoelectronic packaging solutions and subassemblies for the integration of Silicon Photonics, Quantum Dot Lasers and Multi-chip high speed ICs. The position involves supporting new product development by generating manufacturing processes for optical assemblies, including product optimization, as well as for transitioning of new products and processes from R&D into NPI.

This position requires a significant amount of travel to support Ranovus products at our contract manufacturing partner, and through our supply chain.

Responsibilities generally include:

• Provide the process expertise and direct process related feedback within the packaging development team to ensure micro-optoelectronics products are designed for manufacturability.
• Assist in developing design rules that facilitate inspection, testing, and create reliable assembly practices
• Develop new and implement standardized methods, operation sequences and processes in the assembly of optical components, sub-assemblies and final assemblies.
• Develop experiments to verify design concepts during concept and detailed design phases using assembly and test equipment
• Review product requirements with program team to ensure compatibility of processing methods.
• Specify and/or validate new equipment for various assembly processes
• Design, develop, and implement cost-effective methods of manufacturing new products. Improving existing and developing new process ideas to perform Design of Experiments (DOE) and process validation
• Maintain process related engineering records and prepare reports of findings, developments and recommendations.
• Create or modify programs/scripts for automated assembly equipment.
• Develop new or modified process formulations define processing or handling equipment requirements and specifications, and review processing techniques and methods applied in the manufacture, fabrication, and evaluation of the product.
• Generate detailed workflows (Work Instructions) for complex mechanical and optical assemblies.
• May be responsible for initiating, overseeing and driving the qualification of new products and processes prior to release to production.
• Assist in the design of assembly fixtures for die attachment, optical assembly and component placement
• Design of component transport trays and packs for the die handling and attachment.
• Carry out verification in the form of metrology and document results
• InP die attachment process development
• Development of processes compatible with the assembly equipment
• Work in cooperation with the Optical and Packaging design engineers
• Development of assembly-level tests to assess the quality of the products in a very high-volume operation.
• Monitor process data on an ongoing basis and report on yield, throughput, and defect occurrence rates.

Candidate should be experienced with the majority of the following

• Micro/Optoelectonic packaging and assembly technologies
  • Passive and Automated optical alignment
  • Fiber/Receptacle alignment and fixing
  • Laser Welding
  • Die bond (Epoxy and Solder Die Attach)
  • Wire bond (Ball and Wedge)
  • Automated pick and place
  • Micro Welding & Bonding Principles
  • Seam sealing and associated testing
• Optical alignment equipment
• Common optical assembly materials and adhesives
• Determining process capabilities (eg. CpK)
• Optical and electrical test and measurement equipment and tools
• Verification in the form of optoelectronic related metrology
• Industry standard qualification and reliability requirements (MIL-STD, Telecordia)
• Soldering processes
• Design of experiments
• Manufacturing automation
• Mechanical design with AutoCAD or SolidWorks

We are seeking an experienced Software and Firmware Designer to deliver our component and module products as part of a multi-disciplinary team.

Summary of Job Function:

• Implement optoelectronic control algorithms in close collaboration with optical and electrical designers
• Define interface between optoelectronic controller and external line-card software

Key Responsibilities:

• Lead the integration of custom optical devices into micro-controlled optical systems by the creation of µC-to-ASIC communication protocols and algorithms
• Create functional specification and software design for real time embedded systems, structuring software tasks in a multithreaded system for simplicity and performance, writing code with small footprint and efficient memory utilization.
• With the customer, devise card-to-module communication and control protocols
• Define and implement the real-time embedded system framework, OS and development environment including software download, configuration management, boot/initialization, provisioning, alarms and alarm reporting, performance monitoring, tuning and calibration,
• Define and implement command structure utilizing SPI interfacing
• Write software specification and requirements with other subject matter experts
• Contribute to all phases of software development from requirements-gathering through to implementation and sustaining work
• Contribute to the development of project goals, schedules, and resource planning

Requirements And Qualifications:

• Strong architectural and design skills
• Proficient in C/C++ development in a multitasking real-time embedded environment
• Ability to collaborate with experts in other disciplines
• Excellent written and verbal communication skills
• Experience with optoelectronic control algorithm development
• Experience working with ARM processors
• Experience working with MDIO, I2C, SPI and MQX is a plus

Education And Experience:

• Bachelor’s or Master’s degree in Electrical Engineering or Computer Science
• At least 10 years direct experience in an embedded/datapath software design role for control of optical communications systems

The Advanced Optoelectronic Packaging Design group within RANOVUS, represents one of the key elements of product development for next generation all optical datacenter networks.  We are looking for an experienced Senior Packaging designer to work within a multi-disciplinary packaging team to develop state of the art optoelectronic products.  The designer will work closely with RF, optical, and process engineers within the packaging team to successfully develop and implement advanced micro/optoelectronic packages and subassemblies for the integration of Silicon Photonics and Quantum Dot Lasers and Multi-chip high speed ICs. The position involves supporting product development from concept definition, detailed design, prototyping and qualification phases, through to implementation into manufacturing.

Responsibilities generally include:

• Provide the mechanical expertise of a multidisciplinary development team consisting of optical, Silicon Photonics, IC, RF, reliability, manufacturing/process and test engineering, to design modules and micro/optoelectronic packaging solutions to meet product requirements
• Provide design support for and assist in commissioning of active and passive alignment tooling and fixtures for product development and production
• Work with process engineers to create and execute robust DFM processes
• Design mechanical aspects of microelectronic packages & modules, integrating elements of mechanical, thermal, reliability, microelectronic packaging/module integration, manufacturing, test and electrical
• Perform engineering analyses including: Thermal (conductive and convective types), mechanical stress due to CTE mismatch and statistical tolerance
• Generate product documentation including, custom part drawings, assembly drawings, engineering Bill of Materials, common feature drawings and process flows
• Hold and participate in design reviews
• Define specifications/requirements for outsourced custom components and coordinate/interface with manufacturers/suppliers
• Perform engineering product verification to ensure compliance to requirements
• Support product implementation into manufacturing

Candidate should be experienced with:

• Elements of RF/Optical package and module design
• Micro optical assemblies, fiber optic processes, optoelectronic technologies, related materials, solders, adhesives, related components and manufacturing methods
• Layout and design with common micro-electronic interface and feedthrough technologies (Thin film, HTCC, LTCC)
• Optical alignment tools and equipment
• Comprehensive tolerance analysis and simulation using knowledge of assembly, component and processing variances
• Industry standard qualification and reliability requirements (MIL-Spec, Telecordia)
• Design and modeling techniques using analytical and FEM tools (eg. ANSYS) and CAD tools (preferably Solidworks)
• End to end product development and manufacturing implementation of fiber optic components

Candidate should be familiar with:

• Micro-optic/electronic assembly technologies such as die bonding, various flip chip process, wire bonding, lens/fiber/optics alignment, laser welding, glass sealing, UV curing and all associated tooling
• DFM, six-sigma and process control methodologies
• RF and microelectronic material technologies forming multilayered interconnects (HTCC, LTCC, Thin film)
• Basic electronic circuit layout

Skills/Qualifications/Education:

• Relevant engineering degree with multi-year relevant experience working in a product development environment
• Strong verbal and written communication skills, design review and documentation practices.

RANOVUS’ mission is to deliver innovative interconnect solutions to enable a scalable infrastructure to keep pace with the ever-increasing demand for fast, reliable and cost-effective network connectivity.  www.ranovus.com

Working with leading fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking an Senior Optical Systems Designer to contribute to our growth.

Job requirements include:

• Experience in optical system and component test and measurement
• Familiarity with advanced modulation formats
• Verification of optical components based on system specifications
• A proven track record of delivering manufacturable designs

Desirable skills include:

• Experience in fiber-optic system design and modeling
• Fiber-optic network equipment requirement analysis
• Experience working with a spectrum of technology groups: optical, electrical, software and mechanical

RANOVUS has a culture of cross-functional co-operation and design for optimal system performance.  The successful candidate will need to have a history of successful teamwork, and a passion for clear communication of ideas and designs to a technical community.

Based in Ottawa, the position will require working with a variety of experts locally and around the world.

RANOVUS’ mission is to deliver innovative interconnect solutions to enable a scalable infrastructure to keep pace with the ever-increasing demand for fast, reliable and cost-effective network connectivity.  www.ranovus.com

Working with leading fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking an Senior Optical Systems Designer to contribute to our growth.

Job requirements include:

• Experience in fiber-optic system design and modeling
• Familiarity with advanced modulation formats
• Specification of optical components based on system requirements
• A proven track record of delivering manufacturable designs

Desirable skills include:

• Experience in optical system and component test and measurement
• Fiber-optic network equipment requirement analysis
• Experience working with a spectrum of technology groups: optical, electrical, software and mechanical

RANOVUS has a culture of cross-functional co-operation and design for optimal system performance.  The successful candidate will need to have a history of successful teamwork, and a passion for clear communication of ideas and designs to a technical community.

Based in Ottawa, the position will require working with a variety of experts locally and around the world.

RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation interconnects for the telecommunications and information technology industries. RANOVUS’ current disruptive portfolio includes Quantum Dot Multi‐Wavelength Laser technology and advanced digital and photonics integrated circuit technologies that are setting a new industry benchmark for the lowest power dissipation, size and cost for the next generation of optical interconnect solutions.

The company is currently seeking candidates for three internships, to begin no later than January 2017. The candidates should be enrolled in a Ph.D., M.Sc. or M.A.Sc. research degree with a thesis topic which has at least partial alignment with one of the post descriptions below:

1. Silicon photonic device characterization, simulation and design
This position will require measurement of optical devices via both grating and edge‐coupling from optical fibers. Both DC and RF measurements will be performed including the acquisition of large signal data such as eye‐diagrams and determination of bit‐error rates. In addition to experimental work, the position requires optical device simulation and design such as mode‐solving, FDTD, BPM and eigenmode expansion. Experience with chip layout software would be a significant asset.

2. Laser measurement, simulation and design
The successful candidate will measure the performance characteristics of leading edge quantum dot laser structures. Optical measurements will be performed at both low‐speed and at frequencies in the RF range. Experience writing GPIB control algorithms and automating measurement would be very useful. Depending on skills and interest, some activities may involve coupling lasers to photonic integrated circuits.

3. Opto‐electronic packaging
The Advanced Optoelectronic Packaging Design group within RANOVUS, represents one of the key elements of product development for next generation all optical datacenter networks. The Optoelectronic Packaging intern will work within a multi‐disciplinary packaging team to assist in the development of state of the art optoelectronic products. The candidate will work closely with RF, optical, and process engineers within the packaging team to help successfully develop and implement advanced micro/optoelectronic packages and subassemblies. The position involves supporting prototype builds, assisting in the setup of active and passive optical alignment and optical verification stations; writing code for motorized station control and automation; data collection; optical experimental setup and metrology.

Each of the three internships will typically last for four months and will require the candidate to relocate to RANOVUS’ headquarters in Ottawa. Each candidate must have the required legal status within Canada to allow employment as an intern.

We are seeking a Senior Software Designer to deliver our component and module products as part of a multi-disciplinary team.

Summary:

• Design and implement SW Graphic User Interfaces for advanced optoelectronic modules and devices.
• Implement advanced calibration procedures for optical devices including QDL and Silicon photonic devices.
• Implement database for production with data flow management and optimization.

Key Responsibilities:

• Develop the optical module GUI application for internal R&D team and external customer evaluation, from gathering customer requirements, creating functional specification to software design.
• Work closely with the FW team, process engineer and system group to define and implement the GUI application.
• Lead the development of calibration procedures for the advanced optical module using world leading QDL laser and silicon photonic chips. Ensure the process robustness from R&D prototype to volume production.
• Architecture the manufacturing operation with database implementation for seamless data collection, transfer, analysis and output optimization.

Requirements and Qualifications:

• Strong SW architectural and design skills.
• Proficient in C# .NET, OO design principles, coding standards and design patterns.
• Experience with MS Visual Studio, GUI development tools.
• Ability to collaborate with experts in other disciplines.
• Excellent written and verbal communication skills.
• Knowledge of optical devices and optical networking.
• Hands on experience with various optical instruments and automation.
• GUI development for semiconductor/optical devices evaluation is an asset.
• Experience with factory production automation in advanced optoelectronic modules and devices in telecom or data communication environment is an asset.

Education and Experience:

• Bachelor’s or Master’s degree in Electrical Engineering or Computer Science.
• At least 5 years direct experience in GUI development and/or instrument/system automation.

We are seeking a Senior Software verification engineer to deliver our component and module products as part of a multi-disciplinary team.

Summary:

• Responsible for advanced optoelectronic modules and devices SW verification activities.
• Responsible for QSFP/CFP2 optical module SW standard compliance testing.
• Develop SW test/regression test automation.

Key Responsibilities:

• Develop test strategy, test plan and test cases for FW/GUI releases supporting advanced optical modules operation and evaluation.
• Participate in early SW development cycle to contribute to the requirements gathering and high level design from a customer perspective.
• Participate in algorithm improvement and performance feedback for optical device control loops.
• Getting involved in HW/SW integration activities.
• Define SW regression test strategy.
• Prime and develop SW test automation.
• Customer support on product introduction/integration.

Requirements and Qualifications:

• Good knowledge of C#, .NET, OO design principles, coding standards and design patterns.
• Strong SW testing/verification experience with low level electronic devices/drivers.
• Good working knowledge of advanced optical modules such as QSFP, CFP, CPF2/4/8, XFP, SFP, etc.
• Ability to collaborate with experts in other disciplines.
• Experience with SW fault testing.
• Excellent problem reporting, tracking, debugging and solving. Good investigation skills.
• Strong team player with excellent written and verbal communication skills.
• Experience on SW testing automation
• Knowledge on SFF8636, MIP standards will be plus.

Education and Experience:

• Bachelor’s or Master’s degree in Electrical Engineering or Computer Science.
• At least 5 years direct experience of device SW/FW/GUI testing/verification.

We are seeking an Application Engineer to support our customer design-in/win activities globally as part of a multi-disciplinary team.

Key Responsibilities:

RANOVUS’ mission is to deliver innovative interconnect solutions to enable a scalable infrastructure to keep pace with the ever-increasing demand for fast, reliable and cost-effective network connectivity. Application Engineering team is responsible for providing customer support on all Ranovus’ products and technology solutions.

Requirements and Qualifications:

• Understanding of the principles and theory of optical devices (such as lasers, modulators, detectors) and optical transceivers
• Familiarity with advanced modulation formats is a plus
• Working knowledge of inter/intra data center network connectivity requirements
• Working knowledge of industry forums (MSA groups, OIF, IEEE,…)
• Experience working in small and large team (local and remote) interacting with system subject matter experts in the optical, electrical, software and mechanical domains
• Understanding of Product Lifecycle Management
• Prior experience in product requirement definition and documentation processes
• Excellent organizational and time management skills
• Excellent written and oral communication skills
• Availability to travel internationally

Education and Experience:

• A minimum of a Bachelor’s degree in Electrical Engineering or a relevant technical field
• Deep knowledge of fiber-optic transmission systems, including test and measurement methods and equipment with 5 years of experience in the field.