Careers

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity.  RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures.  We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation.  Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking a Semiconductor Laser Designer to contribute to our growth.

As a successful candidate, you will be a key member of our photonics development team and responsible for the design and development of next generation laser sources for Silicon Photonics applications. You will be working in a fast-paced environment where your skillset will be utilized and further developed. Based in Ottawa, you will be working with a variety of experts locally and around the world.

Responsibilities generally include:

• Design, simulation, testing and analysis of semiconductor lasers
  • Design and simulation using state-of-the-art simulation software
  • Develop and maintain design and requirements documentation
  • Define fabrication process
  • Mask layout
  • Data analysis
  • Failure analysis

Candidate should be experienced with:

• Simulations of active photonic devices

• Computer-aided design and layout of lithographic masks corresponding to various process steps in the fabrication of active photonic devices

• Optoelectronic device characterization and testing
• Analysis of active photonic devices
• Design and assembly of optical metrology set ups
• Hands-on lab skills in laser optical characterization, verification and testing

Desirable skills include:

• III-V semiconductor photonic device processing

• Strong background and hands-on experience in the development of InP-based semiconductor lasers
• Experience with InP-based semiconductor optical amplifiers (SOAs)

• Hands-on experience with active photonic simulation tools such as Lumerical and RSoft

• Strong analytical and statistical background
• Excellent written and oral communication skills, self-starter and detail-oriented team player

• The ability to identify risks, develop and implement mitigation strategies
• The ability to independently identify and troubleshoot problems

Required education:

• D. in Electrical Engineering, Photonics or a related discipline with emphasis on III-V optoelectronic devices

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity.  RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures.  We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation.  Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking a Senior Process Engineer to support NPI and Manufacturing Processes.

As a successful candidate, you will be working as the Photonic/ASIC Components integrator, working with Photonics, High Speed ASIC, Laser design teams and Ranovus’ CMs to define best in class optimal assembly processes for high volume Optical Engine (Module) manufacturing, targeted for data center applications. In conjunction with the project team, your role will be to support the micro-assembly process development (and manufacturing work instructions) during all phases of the project development (i.e. During NPI & Production Phase). Specifically, you will work on improvement and optimization of Silicon integrated photonic devices manufacturing & assembly processes.

Responsibilities generally include:

• Support and own the complete assembly process flow of the OE (Module) product:
• Passive optical and mechanical/packaging assembly sequences
• Part placement, adhesive dispense, adhesives curing parameters, metrology
• Material and sub-components management (including supplier audit)
• Active optical alignment processes
• Work on related wafer dicing processes
• Ensure reliability parameters are understood and addressed for the assembly process (de-risked as required for sub-assemblies)
• Work in conjunction with Ranovus’ Design teams & Contract Manufacturing Partners to develop, improve and optimize assembly processes to support high volume production. Analyze, track, evaluate quality of the assemblies coming from the CMs.
• Work with CMs in acceptance and commissioning process of future micro assembly machine to support product ramp
• Work with CMs to ensure processes for wafer level testing, and other assembly test steps are well defined, with optimized processes
• Monitor process data continuously, report on yield, throughput, defect rates, root cause analysis of defects, etc.

Required skills and experience include:

• Experience with Photonic, Laser, and ASIC components and micro-assembly;
• Experience in flip chip, chip on chip die attachment (on wafer), fiber attachment processes;
• 5-10 years of solid experience in related work;
• Excellent ability to solve technical, scientific and experimental problems;
• Excellent teamwork and communication skills;

Required education:

A bachelor (or desirably post graduate degree) in a relevant field: Electronics, Optics, Physics or equivalent studies.