Careers

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity.  RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures.  We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation.  Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking a Senior Process Engineer to support NPI and Manufacturing Processes.

As a successful candidate, you will be working as the Photonic/ASIC Components integrator, working with Photonics, High Speed ASIC, Laser design teams and Ranovus’ CMs to define and design best in class optimal assembly processes for high volume Optical Engine (Module) manufacturing, targeted for data center applications. In conjunction with the project team, your role will be to support the micro-assembly process design and development (and manufacturing work instructions) during all phases of the project development (i.e. During NPI & Production Phase). Specifically, you will work on improvement and optimization of Silicon integrated photonic devices manufacturing & assembly processes.

Responsibilities generally include:

Support and own the complete assembly process flow of the OE (Module) product:

• Passive optical and mechanical/packaging assembly sequencing, design and development
• Part placement, adhesive dispense, adhesives curing parameters, metrology
• Material and sub-components management (including supplier audit)
• Active optical alignment processes, development and optimization
• Work on related wafer dicing processes
• Ensure reliability parameters are understood and addressed for the assembly process (de-risked as required for sub-assemblies)
• Work in conjunction with Ranovus’ Design teams & Contract Manufacturing Partners to develop, improve and optimize assembly processes to support high volume production. Analyze, track, evaluate quality of the assemblies coming from the CMs.
• Work with CMs in acceptance and commissioning process of future micro assembly machine to support product ramp
• Work with CMs to ensure processes for wafer level testing, and other assembly test steps are well defined, with optimized processes
• Monitor process data continuously, report on yield, throughput, defect rates, root cause analysis of defects, etc.

Required skills and experience include:

• Experience with Photonic, Laser, and ASIC components and micro-assembly;
• Experience in flip chip, chip on chip die attachment (on wafer), fiber attachment processes;
• 5-10 years of solid experience in related work;
• Excellent ability to solve technical, scientific and experimental problems;
• Excellent teamwork and communication skills;

Required education:

• A post graduate degree in a relevant field: Electronics, Optics, Physics or equivalent studies.
• Candidates with a bachelors degree will be considered commensurate with relevant experience.

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity.  RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures.  We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation.  Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking a Mechanical Engineer to join our team.

As a successful candidate, you will be working as the Photonic/ASIC Components integrator, working with Photonics, High Speed ASIC, Laser design teams and Ranovus’ CMs to define best in class optimal assembly processes for high volume Optical Engine (Module) manufacturing, targeted for data center applications. In conjunction with the project team, your role will be to support the micro-assembly process development (and manufacturing work instructions) during all phases of the project development (i.e. During NPI & Production Phase). Specifically, you will work on improvement and optimization of Silicon integrated photonic devices manufacturing & assembly processes.

Responsibilities generally include

• Design and develops complex sub-assemblies, components, and packaging as assigned.
• Develops and implements changes to product design and/or the manufacturing process to achieve efficiency, quality, and/or cost improvements by participating in new product development programs.
• Develops requirement specifications, system concepts, CAD generated using SolidWorks, detail drawings, BOM’s and budgets. Makes layouts of complex assemblies and details of parts of devices, mechanisms and structures.
• Provides customer product design engineering for economic production; may participate in meetings with customers.
• Assesses proper material, tooling, automation and equipment selection.
• Works with manufacturing to trouble-shoot problems, upgrades, retrofits, set-ups, methods development, and the development of process parameters.
• Participates in product development meetings and may make recommendations to product design changes to enhance manufacturing and assembly.
• Conduct proof of concept experiments and design other testing requirements as needed.
• Develop SOP’s operations and maintenance manuals.
• Research new technology or development tools to remain informed of current technology.
• Understanding of Lean Six Sigma tools, projects and processes and ability to incorporate these into assigned engineering projects.
• Reviews completed projects for accuracy, clarity and completeness.
• Ensures projects are compliant with all local, regional, and national regulatory requirements, codes and controls.
• Supports all company safety and quality programs and initiatives.
• May perform other duties and responsibilities as assigned.

Required skills and experience include:

• Experience with Photonic, Laser, and ASIC components and micro-assembly;
• Experience in flip chip, chip on chip die attachment (on wafer), fiber attachment processes;
• 5-10 years of solid experience in related work;
• Excellent ability to solve technical, scientific and experimental problems;
• Excellent teamwork and communication skills.

Required education:

• Bachelors in Mechanical Engineering

We are seeking a Field Application Engineer to work closely with our customers, business development, and internal engineering teams on design wins for our Odin™ Silicon Photonics platform.

Responsibilities generally include:

• Work closely with business development and marketing to identify applications and capture design wins for Ranovus’ products with hyperscalers, ASIC vendors and systems integrators
• Be the primary technical interface to and support day-to-day interactions for design wins with customers and partners
• Work closely with product management and internal engineering teams (system architects, designers, testers) to drive customer requirements
• Support the integration and bring up of customer platforms that incorporate Ranovus’ products
• Provide hardware demonstrations to customers and at key industry events
• Prepare and contribute to technical and marketing collateral for customers and partners (application notes, etc.)
• Post-COVID-19, will require frequent travels and flexible schedule.

Required skills and experience:

• Experience as a Field Application Engineer in a semiconductor or systems company
• 2+ years hands-on experience in the areas of SerDes and electrical/optical interconnect products (hardware and software) with a focus on datacenter and embedded systems
• Experience in supporting new product launches and securing design wins
• Experience working in a highly technical environment supporting datacom products and customers
• Excellent relationship management and customer service skills
• Hands-on bring up and testing experience of optical communications and/or networking products and systems
• Familiarity with optical communications systems, silicon photonics, and data centre technologies
• Familiarity with industrial standards such as IEEE 802.3 Ethernet, OIF, PCIe/CXL, MSAs
• Excellent verbal and written communications skills (English essential)
• Detail oriented, excellent analytical and trouble shooting skills
• Self-starting and comfortable working in a highly technical, dynamic, cross-functional team environment

Required education:

• Post graduate degree in a relevant field such as Electrical/Computer Engineering, Physics, Optics, Photonics
• Candidates with a bachelors degree will be considered commensurate with relevant experience

Location:

• Ottawa, Ontario

About Ranovus

Ranovus, with operations in Ottawa, Canada, Nuremberg, Germany and Sunnyvale, USA, develops and manufactures advanced solutions for the next generation of interconnects for the telecommunications and information technology industries. Our team has extensive experience in product development and commercialization of optoelectronics components and transceiver subsystems for the information technology industry.  Ranovus’ current disruptive portfolio includes Quantum Dot Multi-Wavelength Laser technology and advanced digital and silicon photonics integrated circuit technologies that sets a new industry benchmark for the lowest power dissipation, size and cost for the next generation of optical interconnect solutions.

The company was founded in February 2012 and has received financing from leading venture capital firms including Azure Capital Partners, Deutsche Telekom Venture Funds, BDC Capital, OMERS Ventures, Export Development Canada, MaRS Investment Accelerator Fund, as well as Sustainable Development Technology Canada, and Strategic Innovation Fund of Canada.  Additional information about Ranovus can be found at www.ranovus.com.

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity. RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany is a solution provider for the next generation data center infrastructures. We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation. Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data centers.

We are seeking several RF IC Design Engineers to join our team in Ottawa and Nuremberg. 

As a successful candidate you will work in a team responsible for development of advanced mixed signal analog/RF ICs products. These ICs include classical RF analog circuits such as Transimpedance Amplifier and Drivers for high-speed optical links as well as low-speed ADCs, DACs and proprietary mixed-signal circuits.

This position has responsibility for:

• Develop and deploy novel Analog/RF IC circuits for TX and RX at 30+Gbps
• Lab characterization and system performance tests and system development activities
• Multi-disciplinary collaboration with experts from other domains
• Tenacity and propensity to do what it takes to deliver results and meet delivery dates

Skills and experience

• 7+ years experience in high-speed electrical IC design
• Fundamental knowledge of Analog and/or RF IC design, layout and verification methodologies
• Fluency in RF system-level specifications
• Knowledge of optical communications and key building blocks like TIA, Driver, CDR, Equalizers, Photodiode, Modulator
• Understanding of RF device modeling, including but not limited to device noise parameters, mismatch, linearity and inductor modeling
• Insights into packaging effects, supply isolations, high frequency ESD structures, and circuit layout for optimum RF performance
• Experience in lab characterization
• Experience with IC production and foundry interaction
• Demonstrated track record delivering quality products in complete product cycles
• Ability to assume technical lead role to lead and mentor more junior design staff
• Experience work with outsourced subsystem design teams
• Strong team player
• Fluency in English language

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity.  RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany is a solution provider for the next generation data center infrastructures.  We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation.  Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data centers.

We are seeking several RF IC Design Engineers to join our team in Ottawa and Nuremberg. 

As a successful candidate you will work in a team responsible for development of advanced mixed signal analog/RF ICs products. These ICs include classical RF analog circuits such as Transimpedance Amplifier and Drivers for high-speed optical links as well as low-speed ADCs, DACs and proprietary mixed-signal circuits.

This position has responsibility for:

• Develop and deploy novel Analog/RF IC circuits for TX and RX at 30+Gbps
• Lab characterization and system performance tests and system development activities
• Multi-disciplinary collaboration with experts from other domains
• Tenacity and propensity to do what it takes to deliver results and meet delivery dates

Skills and experience

• Minimum of 3 years experience in high-speed electrical IC design
• Fundamental knowledge of Analog and/or RF IC design, layout and verification methodologies
• Fluency in RF system-level specifications
• Knowledge of optical communications and key building blocks like TIA, Driver, CDR, Equalizers, Photodiode, Modulator
• Understanding of RF device modeling, including but not limited to device noise parameters, mismatch, linearity and inductor modeling
• Insights into packaging effects, supply isolations, high frequency ESD structures, and circuit layout for optimum RF performance
• Experience in lab characterization
• Experience with IC production and foundry interaction
• Demonstrated track record delivering quality products in complete product cycles
• Ability to assume technical lead role to lead and mentor more junior design staff
• Experience work with outsourced subsystem design teams
• Strong team player
• Fluency in English language