We're Hiring!

We are currently hiring world-class talent to build our innovative products and company. If you would like to submit your resume
View job opportunities

Recent News
 

Careers

Join Our Team

Our current openings are listed below, however, we welcome all qualified individuals to submit their application. Please use the form on the right to tell us about yourself and submit your resumé.

Optical Process Engineer

Advanced Optoelectronic Packaging

The Advanced Optoelectronic Packaging Design group within Ranovus, represents one of the key elements of overall product development for next generation all optical datacenter networks.  We are looking for an experienced Optical Process Engineer to work within a multi-disciplinary packaging team to develop state of the art optoelectronic products.  The process engineer will work closely with mechanical, RF, and optical engineers, within the packaging team to successfully develop and implement advanced micro/optoelectronic packaging solutions and subassemblies for the integration of Silicon Photonics, Quantum Dot Lasers and Multi-chip high speed ICs. The position involves supporting new product development by generating manufacturing processes for optical assemblies, including product optimization, as well as for transitioning of new products and processes from R&D into NPI.

This position requires a significant amount of travel to support Ranovus products at our contract manufacturing partner, and through our supply chain.

Responsibilities generally include:

  • Provide the process expertise and direct process related feedback within the packaging development team to ensure micro-optoelectronics products are designed for manufacturability.
  • Assist in developing design rules that facilitate inspection, testing, and create reliable assembly practices
  • Develop new and implement standardized methods, operation sequences and processes in the assembly of optical components, sub-assemblies and final assemblies.
  • Develop experiments to verify design concepts during concept and detailed design phases using assembly and test equipment
  • Review product requirements with program team to ensure compatibility of processing methods.
  • Specify and/or validate new equipment for various assembly processes
  • Design, develop, and implement cost-effective methods of manufacturing new products. Improving existing and developing new process ideas to perform Design of Experiments (DOE) and process validation
  • Maintain process related engineering records and prepare reports of findings, developments and recommendations.
  • Create or modify programs/scripts for automated assembly equipment.
  • Develop new or modified process formulations define processing or handling equipment requirements and specifications, and review processing techniques and methods applied in the manufacture, fabrication, and evaluation of the product.
  • Generate detailed workflows (Work Instructions) for complex mechanical and optical assemblies.
  • May be responsible for initiating, overseeing and driving the qualification of new products and processes prior to release to production.
  • Assist in the design of assembly fixtures for die attachment, optical assembly and component placement
  • Design of component transport trays and packs for the die handling and attachment.
  • Carry out verification in the form of metrology and document results
  • InP die attachment process development
  • Development of processes compatible with the assembly equipment
  • Work in cooperation with the Optical and Packaging design engineers
  • Development of assembly-level tests to assess the quality of the products in a very high-volume operation.
  • Monitor process data on an ongoing basis and report on yield, throughput, and defect occurrence rates.

 

Candidate should be experienced with the majority of the following

  • Micro/Optoelectonic packaging and assembly technologies
    • Passive and Automated optical alignment
    • Fiber/Receptacle alignment and fixing
    • Laser Welding
    • Die bond (Epoxy and Solder Die Attach)
    • Wire bond (Ball and Wedge)
    • Automated pick and place
    • Micro Welding & Bonding Principles
    • Seam sealing and associated testing
  • Optical alignment equipment
  • Common optical assembly materials and adhesives
  • Determining process capabilities (eg. CpK)
  • Optical and electrical test and measurement equipment and tools
  • Verification in the form of optoelectronic related metrology
  • Industry standard qualification and reliability requirements (MIL-STD, Telecordia)
  • Soldering processes
  • Design of experiments
  • Manufacturing automation
  • Mechanical design with AutoCAD or SolidWorks
Packaging Engineer - Advanced Optoelectronic Packaging

The Advanced Optoelectronic Packaging Design group within RANOVUS, represents one of the key elements of product development for next generation all optical datacenter networks.  We are looking for an experienced Senior Packaging designer to work within a multi-disciplinary packaging team to develop state of the art optoelectronic products.  The designer will work closely with RF, optical, and process engineers within the packaging team to successfully develop and implement advanced micro/optoelectronic packages and subassemblies for the integration of Silicon Photonics and Quantum Dot Lasers and Multi-chip high speed ICs. The position involves supporting product development from concept definition, detailed design, prototyping and qualification phases, through to implementation into manufacturing.

Responsibilities generally include:

  • Provide the mechanical expertise of a multidisciplinary development team consisting of optical, Silicon Photonics, IC, RF, reliability, manufacturing/process and test engineering, to design modules and micro/optoelectronic packaging solutions to meet product requirements
  • Provide design support for and assist in commissioning of active and passive alignment tooling and fixtures for product development and production
  • Work with process engineers to create and execute robust DFM processes
  • Design mechanical aspects of microelectronic packages & modules, integrating elements of mechanical, thermal, reliability, microelectronic packaging/module integration, manufacturing, test and electrical
  • Perform engineering analyses including: Thermal (conductive and convective types), mechanical stress due to CTE mismatch and statistical tolerance
  • Generate product documentation including, custom part drawings, assembly drawings, engineering Bill of Materials, common feature drawings and process flows
  • Hold and participate in design reviews
  • Define specifications/requirements for outsourced custom components and coordinate/interface with manufacturers/suppliers
  • Perform engineering product verification to ensure compliance to requirements
  • Support product implementation into manufacturing


Candidate should be experienced with:

  • Elements of RF/Optical package and module design
  • Micro optical assemblies, fiber optic processes, optoelectronic technologies, related materials, solders, adhesives, related components and manufacturing methods
  • Layout and design with common micro-electronic interface and feedthrough technologies (Thin film, HTCC, LTCC)
  • Optical alignment tools and equipment
  • Comprehensive tolerance analysis and simulation using knowledge of assembly, component and processing variances
  • Industry standard qualification and reliability requirements (MIL-Spec, Telecordia)
  • Design and modeling techniques using analytical and FEM tools (eg. ANSYS) and CAD tools (preferably Solidworks)
  • End to end product development and manufacturing implementation of fiber optic components


Candidate should be familiar with:

  • Micro-optic/electronic assembly technologies such as die bonding, various flip chip process, wire bonding, lens/fiber/optics alignment, laser welding, glass sealing, UV curing and all associated tooling
  • DFM, six-sigma and process control methodologies
  • RF and microelectronic material technologies forming multilayered interconnects (HTCC, LTCC, Thin film)
  • Basic electronic circuit layout


Skills/Qualifications/Education:

  • Relevant engineering degree with multi-year relevant experience working in a product development environment
  • Strong verbal and written communication skills, design review and documentation practices.
Internship Opportunities

RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation interconnects for the telecommunications and information technology industries. RANOVUS’ current disruptive portfolio includes Quantum Dot Multi‐Wavelength Laser technology and advanced digital and photonics integrated circuit technologies that are setting a new industry benchmark for the lowest power dissipation, size and cost for the next generation of optical interconnect solutions.

The company is currently seeking candidates for three internships, to begin no later than January 2019. The candidates should be enrolled in a Ph.D., M.Sc. or M.A.Sc. research degree with a thesis topic which has at least partial alignment with one of the post descriptions below:

1. Silicon photonic device characterization, simulation and design
This position will require measurement of optical devices via both grating and edge‐coupling from optical fibers. Both DC and RF measurements will be performed including the acquisition of large signal data such as eye‐diagrams and determination of bit‐error rates. In addition to experimental work, the position requires optical device simulation and design such as mode‐solving, FDTD, BPM and eigenmode expansion. Experience with chip layout software would be a significant asset.

2. Laser measurement, simulation and design
The successful candidate will measure the performance characteristics of leading edge quantum dot laser structures. Optical measurements will be performed at both low‐speed and at frequencies in the RF range. Experience writing GPIB control algorithms and automating measurement would be very useful. Depending on skills and interest, some activities may involve coupling lasers to photonic integrated circuits.

3. Opto‐electronic packaging
The Advanced Optoelectronic Packaging Design group within RANOVUS, represents one of the key elements of product development for next generation all optical datacenter networks. The Optoelectronic Packaging intern will work within a multi‐disciplinary packaging team to assist in the development of state of the art optoelectronic products. The candidate will work closely with RF, optical, and process engineers within the packaging team to help successfully develop and implement advanced micro/optoelectronic packages and subassemblies. The position involves supporting prototype builds, assisting in the setup of active and passive optical alignment and optical verification stations; writing code for motorized station control and automation; data collection; optical experimental setup and metrology.

Each of the three internships will typically last for four months and will require the candidate to relocate to RANOVUS’ headquarters in Ottawa. Each candidate must have the required legal status within Canada to allow employment as an intern.

Submit Your Application

Please complete the form below to submit your application to RANOVUS.







Upload your Resumé.

Files types accepted: PDF, .docx
(Max size: 1mb)

ABOUT RANOVUS

RANOVUS is a leading provider of multi-terabit interconnect solutions for datacenter and communications networks. With operations in Canada, USA, and Germany, RANOVUS develops and manufactures advanced solutions for the next generation of interconnects for the telecommunications and information technology industries. Our team has extensive experience in product development and commercialization of optoelectronics components and transceiver subsystems for the information technology industry.

RANOVUS’ current disruptive portfolio includes Quantum Dot Multi-Wavelength Laser technology and advanced digital and photonics integrated circuit technologies that are setting a new industry benchmark for the lowest power dissipation, size and cost for the next generation of optical interconnect solutions.

WordPress Image Lightbox