Odin™ Digital Drive and Analog Drive CPO

Driven by unprecedented growth in AI and Machine Learning workloads, data centre interconnect traffic is increasing at an unprecedented pace and challenges conventional data centre architectures in terms of scalability while minimizing its total power consumption, cost of ownership, and footprint.

Odin™ Digital Drive CPO 1.0

In March 2020, RANOVUS announced a strategic collaboration with TE Connectivity, IBM Inc., and Senko Advanced Components Inc. to deliver a novel Co-packaged Optics interconnect architecture (“CPO 1.0”) to address these challenges. Co-packaged Optics, or CPO, is an innovative approach that provides nx100Gbps PAM4 optical I/O with Ethernet switch and AI/ML silicon in a single packaged assembly.

Product

Key Features

  • Industry-leading cost, size and power consumption
  • Supported by Tier 1 ecosystem and supply chain
  • Integrated on-chip lasers or external laser source options
  • Protocol agnostic
  • Low latency
  • Advanced packaging for high density integration
Odin™ CPO 1.0

Odin™ Analog Drive CPO 2.0

In June 2021, Ranovus extended its strategic collaboration with TE Connectivity, IBM and Senko Advanced Components to introduce the Odin™ Analog Drive CPO 2.0 architecture for hyperscale data centres. The Odin™ Analog Drive CPO 2.0 configuration eliminates the retimer compared to CPO 1.0 which results in a 40% cost and power reduction to the overall system.

Product

Key Features

Odin™ CPO 2.0
  • Interoperability with CPO 1.0
  • Supported by Tier 1 ecosystem and supply chain
  • Integrated on-chip lasers or external laser source options
  • Advanced packaging for high density integration
  • Rate and protocol agnostic (100Gbps, 50Gbps, 32Gbps, 25Gbps)
  • 40% cost and power consumption savings over CPO 1.0
  • Smaller footprint
  • Can re-use existing 100G PAM4 and PCIe Ser/Des chips (versus requiring new investment in an XSR Ser/Des chip for data center applications)