Odin™ Digital Drive CPO 1.0
In March 2020, RANOVUS announced a strategic collaboration with TE Connectivity, IBM Inc., and Senko Advanced Components Inc. to deliver a novel Co-packaged Optics interconnect architecture (“CPO 1.0”) to address these challenges. Co-packaged Optics, or CPO, is an innovative approach that provides nx100Gbps PAM4 optical I/O with Ethernet switch and AI/ML silicon in a single packaged assembly.
- Industry-leading cost, size and power consumption
- Supported by Tier 1 ecosystem and supply chain
- Integrated on-chip lasers or external laser source options
- Protocol agnostic
- Low latency
- Advanced packaging for high density integration