Odin™ Single-chip Optical Engine

RANOVUS’ Odin™ optical engine is the world’s first monolithic Electronic & Photonic Integrated Circuit (EPIC) platform for multi-terabit optical interconnect applications in data centers. Odin™ delivers massive optical interconnect bandwidth with industry-leading cost, size, and power efficiency.

Odin™ Single-chip Optical Engine

RANOVUS’ Odin™ optical engine is the world’s first monolithic Electronic & Photonic Integrated Circuit (EPIC) platform for multi-terabit optical interconnect applications in data centers. Odin™ delivers massive optical interconnect bandwidth with industry-leading cost, size, and power efficiency.

Odin™ Single-chip Optical Engine
Product

Key Features

  • Monolithic integration of silicon photonics, RF drivers & TIA, and control logic for high bit-rate operation (100Gbps PAM4)
  • Includes patented silicon photonics based Micro Ring Resonator modulators, multi-wavelength Quantum Dot Lasers, and photodetectors.
  • Industry-leading cost, size and power consumption
  • Supported by Tier 1 ecosystem and supply chain
  • Integrated on-chip lasers or external laser source options
  • Protocol agnostic for Ethernet & AI/ML applications
  • Low latency
  • Advanced packaging for high density integration
  • Low cost, high yield fiber & laser attach technology
  • Compatible with RANOVUS’ Odin™ CPO 2.0 and CPO 1.0

Applications

icon ethernet

Ethernet

Odin™ optical engines deliver industry-leading cost, power, and footprint efficiency for high-capacity optical plug-in modules for optical I/O in data centres

icon brian circuits

Multi-terabit interconnects for AI/ML Workloads

Odin™ protocol-agnostic optical engines enable new AI/ML architectures optimized for AI/ML workloads that minimize total power, footprint, and power consumption in data centres

icon brian circuits

Co-Packaged Optics (CPO) Applications in Data Centers

Odin™ high-capacity optical engines enable new approaches for co-packaging nx100Gbps PAM4 optical I/O with Ethernet switch and AI/ML silicon in a single packaged assembly