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Our current openings are listed below, however, we welcome all qualified individuals to submit their application. Please use the form on the right to tell us about yourself and submit your resumé.

Opto-Electronic Measurement Technician

RANOVUS’ mission is to deliver innovative interconnect solutions to enable a scalable infrastructure to keep pace with the ever-increasing demand for fast, reliable and cost-effective network connectivity.  www.ranovus.com

Working with leading fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking an Senior Optical Systems Designer to contribute to our growth.

Job requirements include:

  • After initial training have the ability to work independently
  • Provide test and measurement support through NPI process by measuring small to medium numbers of devices, such as laser bar and die testing.
  • Give feedback on test and measurement processes and suggest improvements
  • Input data into spread sheet to track devices across multiple processing steps
  • Provide input for test and measurement documentation

 

Desirable skills include:

  • Experience in opto-electronic component test and measurement, such as wafer probe, running automated test stations, aligning electrical probes and optical fiber
  • Experience with optical fiber, cleaning connectors, splicing fiber, ensure proper connection
  • Experience in developing work instructions to document test steps
  • Exposure to Microsoft Word, Excel etc.

 

RANOVUS has a culture of cross-functional co-operation and design for optimal system performance.  The successful candidate will need to have a history of successful teamwork, and a passion for clear communication of ideas and designs to a technical community.

Based in Ottawa, the position will require working with a variety of experts locally and around the world.

Senior Software And Firmware Designer

We are seeking an experienced Software and Firmware Designer to deliver our component and module products as part of a multi-disciplinary team.

Summary of Job Function:

  • Implement optoelectronic control algorithms in close collaboration with optical and electrical designers
  • Define interface between optoelectronic controller and external line-card software


Key Responsibilities:

  • Lead the integration of custom optical devices into micro-controlled optical systems by the creation of µC-to-ASIC communication protocols and algorithms
  • Create functional specification and software design for real time embedded systems, structuring software tasks in a multithreaded system for simplicity and performance, writing code with small footprint and efficient memory utilization.
  • With the customer, devise card-to-module communication and control protocols
  • Define and implement the real-time embedded system framework, OS and development environment including software download, configuration management, boot/initialization, provisioning, alarms and alarm reporting, performance monitoring, tuning and calibration,
  • Define and implement command structure utilizing SPI interfacing
  • Write software specification and requirements with other subject matter experts
  • Contribute to all phases of software development from requirements-gathering through to implementation and sustaining work
  • Contribute to the development of project goals, schedules, and resource planning


Requirements And Qualifications:

  • Strong architectural and design skills
  • Proficient in C/C++ development in a multitasking real-time embedded environment
  • Ability to collaborate with experts in other disciplines
  • Excellent written and verbal communication skills
  • Experience with optoelectronic control algorithm development
  • Experience working with ARM processors
  • Experience working with MDIO, I2C, SPI and MQX is a plus


Education And Experience:

  • Bachelor’s or Master’s degree in Electrical Engineering or Computer Science
  • At least 10 years direct experience in an embedded/datapath software design role for control of optical communications systems
Packaging Engineer - Advanced Optoelectronic Packaging

The Advanced Optoelectronic Packaging Design group within RANOVUS, represents one of the key elements of product development for next generation all optical datacenter networks.  We are looking for an experienced Senior Packaging designer to work within a multi-disciplinary packaging team to develop state of the art optoelectronic products.  The designer will work closely with RF, optical, and process engineers within the packaging team to successfully develop and implement advanced micro/optoelectronic packages and subassemblies for the integration of Silicon Photonics and Quantum Dot Lasers and Multi-chip high speed ICs. The position involves supporting product development from concept definition, detailed design, prototyping and qualification phases, through to implementation into manufacturing.

Responsibilities generally include:

  • Provide the mechanical expertise of a multidisciplinary development team consisting of optical, Silicon Photonics, IC, RF, reliability, manufacturing/process and test engineering, to design modules and micro/optoelectronic packaging solutions to meet product requirements
  • Provide design support for and assist in commissioning of active and passive alignment tooling and fixtures for product development and production
  • Work with process engineers to create and execute robust DFM processes
  • Design mechanical aspects of microelectronic packages & modules, integrating elements of mechanical, thermal, reliability, microelectronic packaging/module integration, manufacturing, test and electrical
  • Perform engineering analyses including: Thermal (conductive and convective types), mechanical stress due to CTE mismatch and statistical tolerance
  • Generate product documentation including, custom part drawings, assembly drawings, engineering Bill of Materials, common feature drawings and process flows
  • Hold and participate in design reviews
  • Define specifications/requirements for outsourced custom components and coordinate/interface with manufacturers/suppliers
  • Perform engineering product verification to ensure compliance to requirements
  • Support product implementation into manufacturing


Candidate should be experienced with:

  • Elements of RF/Optical package and module design
  • Micro optical assemblies, fiber optic processes, optoelectronic technologies, related materials, solders, adhesives, related components and manufacturing methods
  • Layout and design with common micro-electronic interface and feedthrough technologies (Thin film, HTCC, LTCC)
  • Optical alignment tools and equipment
  • Comprehensive tolerance analysis and simulation using knowledge of assembly, component and processing variances
  • Industry standard qualification and reliability requirements (MIL-Spec, Telecordia)
  • Design and modeling techniques using analytical and FEM tools (eg. ANSYS) and CAD tools (preferably Solidworks)
  • End to end product development and manufacturing implementation of fiber optic components


Candidate should be familiar with:

  • Micro-optic/electronic assembly technologies such as die bonding, various flip chip process, wire bonding, lens/fiber/optics alignment, laser welding, glass sealing, UV curing and all associated tooling
  • DFM, six-sigma and process control methodologies
  • RF and microelectronic material technologies forming multilayered interconnects (HTCC, LTCC, Thin film)
  • Basic electronic circuit layout


Skills/Qualifications/Education:

  • Relevant engineering degree with multi-year relevant experience working in a product development environment
  • Strong verbal and written communication skills, design review and documentation practices.
Senior Optical Systems Designer - Measurement

RANOVUS’ mission is to deliver innovative interconnect solutions to enable a scalable infrastructure to keep pace with the ever-increasing demand for fast, reliable and cost-effective network connectivity.  www.ranovus.com

Working with leading fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking an Senior Optical Systems Designer to contribute to our growth.

Job requirements include:

  • Experience in optical system and component test and measurement
  • Familiarity with advanced modulation formats
  • Verification of optical components based on system specifications
  • A proven track record of delivering manufacturable designs

 

Desirable skills include:

  • Experience in fiber-optic system design and modeling
  • Fiber-optic network equipment requirement analysis
  • Experience working with a spectrum of technology groups: optical, electrical, software and mechanical

 

RANOVUS has a culture of cross-functional co-operation and design for optimal system performance.  The successful candidate will need to have a history of successful teamwork, and a passion for clear communication of ideas and designs to a technical community.

Based in Ottawa, the position will require working with a variety of experts locally and around the world.

Senior Optical Systems Designer - Modeling

RANOVUS’ mission is to deliver innovative interconnect solutions to enable a scalable infrastructure to keep pace with the ever-increasing demand for fast, reliable and cost-effective network connectivity.  www.ranovus.com

Working with leading fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking an Senior Optical Systems Designer to contribute to our growth.

Job requirements include:

  • Experience in fiber-optic system design and modeling
  • Familiarity with advanced modulation formats
  • Specification of optical components based on system requirements
  • A proven track record of delivering manufacturable designs

 

Desirable skills include:

  • Experience in optical system and component test and measurement
  • Fiber-optic network equipment requirement analysis
  • Experience working with a spectrum of technology groups: optical, electrical, software and mechanical

 

RANOVUS has a culture of cross-functional co-operation and design for optimal system performance.  The successful candidate will need to have a history of successful teamwork, and a passion for clear communication of ideas and designs to a technical community.

Based in Ottawa, the position will require working with a variety of experts locally and around the world.

Internship Opportunities

RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation interconnects for the telecommunications and information technology industries. RANOVUS’ current disruptive portfolio includes Quantum Dot Multi‐Wavelength Laser technology and advanced digital and photonics integrated circuit technologies that are setting a new industry benchmark for the lowest power dissipation, size and cost for the next generation of optical interconnect solutions.

The company is currently seeking candidates for three internships, to begin no later than January 2017. The candidates should be enrolled in a Ph.D., M.Sc. or M.A.Sc. research degree with a thesis topic which has at least partial alignment with one of the post descriptions below:

1. Silicon photonic device characterization, simulation and design
This position will require measurement of optical devices via both grating and edge‐coupling from optical fibers. Both DC and RF measurements will be performed including the acquisition of large signal data such as eye‐diagrams and determination of bit‐error rates. In addition to experimental work, the position requires optical device simulation and design such as mode‐solving, FDTD, BPM and eigenmode expansion. Experience with chip layout software would be a significant asset.

2. Laser measurement, simulation and design
The successful candidate will measure the performance characteristics of leading edge quantum dot laser structures. Optical measurements will be performed at both low‐speed and at frequencies in the RF range. Experience writing GPIB control algorithms and automating measurement would be very useful. Depending on skills and interest, some activities may involve coupling lasers to photonic integrated circuits.

3. Opto‐electronic packaging
The Advanced Optoelectronic Packaging Design group within RANOVUS, represents one of the key elements of product development for next generation all optical datacenter networks. The Optoelectronic Packaging intern will work within a multi‐disciplinary packaging team to assist in the development of state of the art optoelectronic products. The candidate will work closely with RF, optical, and process engineers within the packaging team to help successfully develop and implement advanced micro/optoelectronic packages and subassemblies. The position involves supporting prototype builds, assisting in the setup of active and passive optical alignment and optical verification stations; writing code for motorized station control and automation; data collection; optical experimental setup and metrology.

Each of the three internships will typically last for four months and will require the candidate to relocate to RANOVUS’ headquarters in Ottawa. Each candidate must have the required legal status within Canada to allow employment as an intern.

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ABOUT RANOVUS

RANOVUS is a leading provider of multi-terabit interconnect solutions for datacenter and communications networks. With operations in Canada, USA, and Germany, RANOVUS develops and manufactures advanced solutions for the next generation of interconnects for the telecommunications and information technology industries. Our team has extensive experience in product development and commercialization of optoelectronics components and transceiver subsystems for the information technology industry.

RANOVUS’ current disruptive portfolio includes Quantum Dot Multi-Wavelength Laser technology and advanced digital and photonics integrated circuit technologies that are setting a new industry benchmark for the lowest power dissipation, size and cost for the next generation of optical interconnect solutions.

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