Odin™ Single-chip
Optical Engine Platform
Enabling Next Generation Data Center Infrastructure
Featured News
Ranovus Announces Single Chip Odin™ Analog-Drive for Its Second Generation “Co-Packaged Optics” in Hyperscale Data Center
The Ranovus Odin™ Analog-Drive CPO 2.0 configuration for Ethernet Switch and ML/AI applicationsRanovus’ Odin™ Analog-Drive...
Odin™ Single-chip Optical Engine Platform
Enabling Next Generation Data Center Infrastructure
Featured News
Ranovus Announces Single Chip Odin™ Analog-Drive for Its Second Generation “Co-Packaged Optics” in Hyperscale Data Center
The Ranovus Odin™ Analog-Drive CPO 2.0 configuration for Ethernet Switch and ML/AI applicationsRanovus’ Odin™ Analog-Drive...
Odin™ Single-chip
Optical Engine
Ranovus’ Odin™ platform is the world’s first monolithic silicon photonics interconnect platform for multi-terabit optical interconnect applications in data centers.
Establishing New Industry Benchmarks
RANOVUS’ disruptive innovation in Quantum Dot Multi-Wavelength Lasers combined with advanced mixed signal IE and silicon photonics has established new industry benchmarks for cost, power consumption and size.
Disruptive Technology
- Multi-Wavelength Quantum Dot Lasers
- Micro Ring Resonators
- Silicon Photonics and advanced mixed signal IC
- Advanced packaging technologies for high-density integration and volume manufacturing
- High-yield low-cost fiber and laser attach for silicon photonic ICs
Next Generation Cloud
- Odin™ is the world’s first monolithic Electronic & Photonic Integrated Circuit (EPIC) platform for multi-terrabit optical interconnect applications in data centres
- Odin™ delivers massive optical interconnect bandwidth with industry-leading cost, size, and power efficiency.
- Odin™ enables new Co-Packaged Optics (CPO) architectures for unprecedented density, cost, and power efficiency
- Supported by Tier1 ecosystem and supply chain
more
Next Generation Cloud
- Ranovus uniquely brings together a multi-disciplinary team of industry experts in optoelectronic, lasers, silicon photonics, RF, mixed signal ASIC, advanced packaged and volume manufacturing
- Our passion is creating disruptive products that address the pressing need for high optical interconnect capacity in data centres for AI/ML workloads
more
Disruptive Technology
- Multi-Wavelength Quantum Dot Lasers
- Micro Ring Resonators
- Silicon Photonics and advanced mixed signal IC
- Advanced packaging technologies for high-density integration and volume manufacturing
- High-yield low-cost fiber and laser attach for silicon photonic ICs
Innovative Solutions
- Odin™ is the world’s first monolithic Electronic & Photonic Integrated Circuit (EPIC) platform for multi-terrabit optical interconnect applications in data centres
- Odin™ delivers massive optical interconnect bandwidth with industry-leading cost, size, and power efficiency.
- Odin™ enables new Co-Packaged Optics (CPO) architectures for unprecedented density, cost, and power efficiency
- Supported by Tier1 ecosystem and supply chain
Disruptive Innovators
- Ranovus uniquely brings together a multi-disciplinary team of industry experts in optoelectronic, lasers, silicon photonics, RF, mixed signal ASIC, advanced packaged and volume manufacturing
- Our passion is creating disruptive products that address the pressing need for high optical interconnect capacity in data centres for AI/ML workloads