Enabling Next Generation Data Center Infrastructure

RANOVUS is unique in the industry in that we have brought together a multi-disciplinary team of industry experts in optoelectronic subsystems, Laser, Silicon Photonics, RF, mixed signal ASIC, advanced packaging, volume manufacturing, system design, and technology commercialization to tackle some of the most difficult technology challenges in optical interconnect and co-packaged optics for AI/ML in data center application. Our passion is realizing disruptive and innovative product solutions that address the pressing need for high optical interconnect capacity in data centers being optimized for AI/ML workloads. Our products leverage RANOVUS’ disruptive portfolio of patented technologies, including Multi-wavelength Quantum Dot Lasers and advanced digital and silicon photonics integrated circuit technologies, to set new industry benchmarks for lowest power dissipation, size, and cost for monolithically integrated silicon photonic products.

Quantum Dot Multi-wavelength Laser

The RANOVUS Quantum Dot Multi-Wavelength Laser (QD MWL) is a semiconductor laser that utilizes self-assembled quantum dots to generate multiple wavelengths simultaneously from a single device.  A single QD MWL device can provide up to 96 wavelengths in the C-band alone, allowing for the replacement of 96 individual lasers in an equivalent system.

QD MWL based solutions allow for a much simpler and compact interface design resulting in lower power consumption and better performance when compared to an equivalent solution having multiple discrete lasers and components. The unique advantage of a QD MWL is its ability to provide multiple wavelengths simultaneously, each of which can be selected and used as a light source for data transmission at 100 Gbs/ lambda and beyond.

Silicon Photonic Ring Resonators

In recent years, photonic integration has become a key area of research and development for optical network equipment vendors wanting to reduce the cost and size of optical interfaces. Silicon technology and integration allows system vendors to replace expensive optical components with their silicon counterparts such as; modulators, multiplexer/demultiplexer, filters, attenuators, switches and detectors.

RANOVUS is using a unique approach in designing Silicon Photonics based devices by implementing optical modulation on micro-Ring Resonator architecture that enable high-speed modulation at data rates of up to 100Gbs / lambda.

These ring modulators act like a wavelength sensitive switch. When the ring is not in resonance, the optical signal passes straight through with minimal loss. Conversely, when the ring is resonant, the optical signal is coupled into the ring and is no longer passed through.  Modulators are fabricated with a silicon-on-insulator process using silicon waveguides that provide a natural vertical and lateral confinement via a ridge. Such ring resonators are ideal Wavelength-Division Multiplexing (WDM) building blocks and can be cascaded to construct WDM transceivers. In such a construct, each ring provides a multiplexing, demultiplexing and modulation operation in a geometry that’s well suited to extreme scaling of many channels.


Advanced Packaging Technology and Enablement

RANOVUS has brought together industry experts in advanced packaging technologies to develop a new generation of monolithic Electronic & Photonic Integrated Circuits (EPIC) packaging solutions. RANOVUS provides packaged and qualified Odin™ optical engines. For co-packaged optics applications, RANOVUS can work with your Outsourced Semiconductor Assembly and Test (OSAT) contract manufacturer to bring you the lowest cost and highest reliability solutions.

RANOVUS’ patented wafer scale laser attach process enables a new generation of cost effective and reliable optical engines for demanding AI/ML and Ethernet Module applications. RANOVUS’ proprietary laser and laser attach are optimized for RANOVUS’ monolithic EPIC to deliver the lowest cost, highest reliability and performance to the hyperscale Data Center customers.

Bringing light in and out of an EPIC reliably with lowest optical loss and cost is a significant challenge for today’s OSAT contract manufacturers. RANOVUS has developed an OSAT enablement process to work with your OSAT and prepare them to successfully undertake this challenge.

RANOVUS is your advanced packaging partner for partner for the next-generation of laser and fiber attach technologies optimized for the monolithic EPIC.

Advanced Package technology