Quantum Dot Multi-wavelength Laser
The RANOVUS Quantum Dot Multi-Wavelength Laser (QD MWL) is a semiconductor laser that utilizes self-assembled quantum dots to generate multiple wavelengths simultaneously from a single device. A single QD MWL device can provide up to 96 wavelengths in the C-band alone, allowing for the replacement of 96 individual lasers in an equivalent system.
QD MWL based solutions allow for a much simpler and compact interface design resulting in lower power consumption and better performance when compared to an equivalent solution having multiple discrete lasers and components. The unique advantage of a QD MWL is its ability to provide multiple wavelengths simultaneously, each of which can be selected and used as a light source for data transmission at 100 Gbs/ lambda and beyond.
Advanced Packaging Technology and Enablement
RANOVUS has brought together industry experts in advanced packaging technologies to develop a new generation of monolithic Electronic & Photonic Integrated Circuits (EPIC) packaging solutions. RANOVUS provides packaged and qualified Odin™ optical engines. For co-packaged optics applications, RANOVUS can work with your Outsourced Semiconductor Assembly and Test (OSAT) contract manufacturer to bring you the lowest cost and highest reliability solutions.
RANOVUS’ patented wafer scale laser attach process enables a new generation of cost effective and reliable optical engines for demanding AI/ML and Ethernet Module applications. RANOVUS’ proprietary laser and laser attach are optimized for RANOVUS’ monolithic EPIC to deliver the lowest cost, highest reliability and performance to the hyperscale Data Center customers.
Bringing light in and out of an EPIC reliably with lowest optical loss and cost is a significant challenge for today’s OSAT contract manufacturers. RANOVUS has developed an OSAT enablement process to work with your OSAT and prepare them to successfully undertake this challenge.
RANOVUS is your advanced packaging partner for partner for the next-generation of laser and fiber attach technologies optimized for the monolithic EPIC.