Odin™ 8x100G PAM4 Direct Drive for Co-Packaged Optics
Odin™ 8x100G PAM4 Direct Drive for Co-Packaged Optics
Ottawa, Ontario, December 17, 2021
RANVOUS Inc. (“RANOVUS”), a leading supplier of silicon photonics optical interconnect solutions for next generation ML/AI workloads in data centers, today announced the organization is a recipient of the 2021 DesignCon Best Paper Award. The awards program honors RANOVUS for its outstanding contribution to the diverse educational goals of DesignCon, the nation’s premiere event for chip, board, and systems design engineers. The Best Paper Awards also serve to acknowledge the authors who receive them as leading practitioners in semiconductor and electronic design.
RANOVUS is unique in the industry in that the company has brought together a multi-disciplinary team of industry experts in optoelectronic subsystems, laser, Silicon Photonics, RF, mixed signal ASIC, advanced packaging, volume manufacturing, system design, and technology commercialization to tackle some of the most difficult challenges in optical interconnect and co-packaged optics (CPO) for data centers.
“This Best Paper Award underscores the pressing need for high-capacity optical interconnect in data centers”, said Dr. Christoph Schulien, SVP of R&D and Systems at Ranovus. “As data centers increasingly focus on optimizing ML/AI workloads, our Odin™ Analog Optical Engine platform is uniquely positioned to establish new industry benchmarks for lowest power dissipation, size, and cost for monolithically integrated silicon photonic CPO interconnects.”
“We are proud to celebrate this year’s recipients of the Best Paper Awards for their remarkable achievements,” said Naomi Price, conference director, Informa Markets. “It’s important to recognize the individuals and organizations that are fundamental to the advancement of the semiconductor and electronic engineering industries. Each participating author has made a meaningful contribution to an industry that values innovation and technical creativity.”
Recipients of DesignCon’s Paper Award are selected through a two-prong process. The first step is a review of the full-length papers accepted by the members of the DesignCon Technical Program Committee, who then rank and determine the finalists for each award category based on quality, relevance, impact, originality, and lack of commercial content. Winners are then chosen from the finalists based on the quality of their presentations at the conference as rated by the attendees.
For more information on DesignCon and the awards program and to learn more about the 2022 award program, please visit: DesignCon.com.
RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany and Sunnyvale, USA, develops and manufactures advanced photonics interconnect solutions to support the next generation of AI/ML workloads in data centers and communication networks. Our team has extensive experience in product development and commercialization of optoelectronics subsystems for the information technology industry. Ranovus’ current disruptive portfolio includes Multi-Wavelength Quantum Dot Laser technology and advanced digital and silicon photonics integrated circuit technologies that set a new industry benchmark for the lowest power dissipation, size, and cost for the next generation of optical interconnect solutions. Ranovus’ Odin™ platform is the enabling technology for a new data center architecture optimized for AI/ML workloads. For more information, please visit www.ranovus.com.
LouVan Comm Inc.
DesignCon is the world’s premier conference for chip, board, and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board, and systems designers in the country. This three-day technical conference and two-day expo combines technical paper sessions, tutorials, industry panels, product demos, and exhibits from the industry’s leading experts and solutions providers. More information is available at: www.designcon.com. DesignCon is organized by is organized by Informa, a leading B2B information services group and the largest B2B events and exhibitions organizer in the world. To learn more and for the latest news and information, visit www.informa.com.
The health & safety of the DesignCon and Drive World+ESC community remains a top priority. Health and safety information can be found on DesignCon’s website and will be updated as venue and local protocols advance.
About Informa Markets
Informa Markets creates platforms for industries and specialist markets to trade, innovate and grow. Our portfolio is comprised of more than 550 international B2B events and brands in markets including Engineering, Healthcare & Pharmaceuticals, Infrastructure, Construction & Real Estate, Fashion & Apparel, Hospitality, Food & Beverage, and Health & Nutrition, among others. We provide customers and partners around the globe with opportunities to engage, experience and do business through face-to-face exhibitions, specialist digital content and actionable data solutions. As the world’s leading exhibitions organizer, we bring a diverse range of specialist markets to life, unlocking opportunities and helping them to thrive 365 days of the year. For more information, please visit www.informamarkets.com.