Making NPO and CPO Real for Scaling AI
Lighting up the future of AI™
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Market Inflection and Expansive Opportunity
- GPU clusters are facing physical limitations. Optical interconnect is the only solution that allows GPU clusters to scale beyond a rack
- Multi-billion-dollar TAM, as AI workloads necessitate larger and larger compute nodes
Differentiated Capabilities
- Proprietary Quantum Dot and Quantum Well Lasers, RAMZI Modulators, and monolithic integration for world-first performance
- Deep expertise across silicon photonics, mixed-signal design, and advanced packaging
Ethernet Compatibility Offering Unmatched Competitive Edge
- Ethernet-compatible, validated optical solutions ready for large-scale deployment
- Competitors remain focused on narrow, proprietary use cases
Proven Execution and Tier-1 Validation
- Multi-terabit optical engines validated by Tier-1 customers
- Demonstrated delivery reliability and commercial traction
Business Model Strength
- Rapid growth with high gross margins and strong capital efficiency
- Flexible Co-Development business model for large volume deployment
Disciplined Scaling Strategy
- Expanding manufacturing to TSMC while maintaining capital efficiency — scaling on only $158M of total capital infusion
- Accelerating customer programs and product availability through focused execution
ODIN® Single-chip
Optical Engine
Ranovus®’ ODIN® platform is the world’s first monolithic silicon photonics 100Gbps interconnect platform for multi-terabit optical interconnect applications in data centers.
Innovation
Happens Here.
Our passion is creating disruptive products that address the pressing need for high-capacity optical interconnect in next-generation data centres.
Establishing New Industry Benchmarks
RANOVUS®’ disruptive innovation in Quantum Dot Multi-Wavelength Lasers combined with advanced mixed signal IE and silicon photonics has established new industry benchmarks for cost, power consumption and size.
Disruptive Technology
- Multi-Wavelength Quantum Dot Lasers
- Micro Ring Resonators
- Silicon Photonics and advanced mixed signal IC
- Advanced packaging technologies for high-density integration and volume manufacturing
- High-yield low-cost fiber and laser attach for silicon photonic ICs
Next Generation Cloud
- ODIN® is the world’s first monolithic Electronic & Photonic Integrated Circuit (EPIC) platform for multi-terrabit optical interconnect applications in data centres
- ODIN® delivers massive optical interconnect bandwidth with industry-leading cost, size, and power efficiency.
- ODIN® enables new Co-Packaged Optics (CPO) architectures for unprecedented density, cost, and power efficiency
- Supported by Tier1 ecosystem and supply chain
more
Next Generation Cloud
- Ranovus® uniquely brings together a multi-disciplinary team of industry experts in optoelectronic, lasers, silicon photonics, RF, mixed signal ASIC, advanced packaged and volume manufacturing
- Our passion is creating disruptive products that address the pressing need for high optical interconnect capacity in data centres for AI/ML workloads
more
Disruptive Technology
- Multi-Wavelength Quantum Dot Lasers
- Micro Ring Resonators
- Silicon Photonics and advanced mixed signal IC
- Advanced packaging technologies for high-density integration and volume manufacturing
- High-yield low-cost fiber and laser attach for silicon photonic ICs
Innovative Solutions
- ODIN® is the world’s first monolithic Electronic & Photonic Integrated Circuit (EPIC) platform for multi-terrabit optical interconnect applications in data centres
- ODIN® delivers massive optical interconnect bandwidth with industry-leading cost, size, and power efficiency.
- ODIN® enables new Co-Packaged Optics (CPO) architectures for unprecedented density, cost, and power efficiency
- Supported by Tier1 ecosystem and supply chain
Disruptive Innovators
- Ranovus® uniquely brings together a multi-disciplinary team of industry experts in optoelectronic, lasers, silicon photonics, RF, mixed signal ASIC, advanced packaged and volume manufacturing
- Our passion is creating disruptive products that address the pressing need for high optical interconnect capacity in data centres for AI/ML workloads