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Co-Package Optics (CPO) Takes a Huge Step Forward

Co-Package Optics (CPO) Takes a Huge Step Forward

by Mountain Web Media | Apr 4, 2024 | News

Watch Ranovus CEO, discusses the growth of co-package optics and the significant investment by industry giants such as TSMC, Nvidia, Broadcom, AMD/Xilinx, SilTerra, and Mediatech. Arabzadeh highlights the company’s new generation of co-package optics that...
RANOVUS delivers industry’s first 6.4Tbps Co-Packaged Optics with integrated laser for AI/ML application at OFC 2024

RANOVUS delivers industry’s first 6.4Tbps Co-Packaged Optics with integrated laser for AI/ML application at OFC 2024

by Mountain Web Media | Mar 20, 2024 | News

MediaTek® ASIC co-packaged with 6.4Tbps RANOVUS’ Odin® direct-drive CPO 3.0 Ranovus’ standards compliant Odin® direct-drive CPO 3.0 optical interconnect, with 4pJ/bit energy efficiency, including the laser, delivers the highest 100Gbps optical I/O radix in smallest...
Ranovus® demonstrates industry’s lowest power consumption 800Gbps Ethernet interoperable link to scale AMD adaptive SoCs for AI/ML

Ranovus® demonstrates industry’s lowest power consumption 800Gbps Ethernet interoperable link to scale AMD adaptive SoCs for AI/ML

by Mountain Web Media | Mar 6, 2023 | News

Xilinx Versal ACAP co-packaged with Ranovus’ Odin™ Analog-Drive CPO 2.0 Ranovus’ standards compliant Odin® direct-drive CPO 2.0 optical interconnect, with 5pJ/bit energy efficiency, is best-in-class for co-packaged, near-packaged optics and pluggable module form...
Ranovus® Announces Second-Generation “Co-Packaged Optics” Chip for  Hyperscale Data Center Applications

Ranovus® Announces Second-Generation “Co-Packaged Optics” Chip for Hyperscale Data Center Applications

by Mountain Web Media | Jun 7, 2021 | News

The Ranovus Odin™ Analog-Drive CPO 2.0 configuration for Ethernet Switch and ML/AI applications Ranovus extends its partnership with IBM, TE Connectivity, and Senko Advanced Components to deliver significant power and cost savings with its “CPO 2.0” technology San...
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