Odin® Chiplets and
IP Cores

Odin® 100G optical I/O chiplets and IP cores can be integrated with processors, switches, and memory appliances to enable new data centre architectures for machine learning, artificial intelligence, metaverse, cloud, 5G communications, and defence and aerospace. Data centres are increasingly demanding efficient and cost-effective high-capacity interconnect solutions to meet the exponential growth in data-driven applications like ML/AI and metaverse.

Odin® 100Gbps optical I/O scales from 8- to 32-cores in a highly footprint-efficient manner by combining RANOVUS®’ 100Gbps per wavelength monolithic EPIC (Electro-Photonic Integrated Circuit) cores with its proprietary laser and advanced packaging technologies.

Odin™ Chiplets And IP Cores

Odin® Chiplets and
IP Cores

Odin™ Chiplets And IP Cores

Odin® 100G optical I/O chiplets and IP cores can be integrated with processors, switches, and memory appliances to enable new data centre architectures for machine learning, artificial intelligence, metaverse, cloud, 5G communications, and defence and aerospace. Data centres are increasingly demanding efficient and cost-effective high-capacity interconnect solutions to meet the exponential growth in data-driven applications like ML/AI and metaverse.

Odin® 100Gbps optical I/O scales from 8- to 32-cores in a highly footprint-efficient manner by combining RANOVUS®’ 100Gbps per wavelength monolithic EPIC (Electro-Photonic Integrated Circuit) cores with its proprietary laser and advanced packaging technologies.

Product

Key Features

  • RANOVUS®’ Odin® optical I/O cores set industry benchmarks for high bandwidth, low power consumption and small size for AI, cloud, metaverse, and communications applications
  • Customers can leverage Ranovus®’ 100Gbps per lambda monolithic Electro-Photonic Integrated Circuit (EPIC) IP, laser platform, and advanced packaging technologies.
  • Fully featured set of qualified IP cores and chiplets with OSAT-ready high-volume manufacturing flows and supporting ecosystem
  • Supports highly flexible packaging options including co-packaged optics architectures like Analog-Drive CPO 2.0

Applications

icon ethernet

Ethernet

Odin® optical engines deliver industry-leading cost, power, and footprint efficiency for high-capacity optical plug-in modules for optical I/O in data centres
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Multi-terabit interconnects for AI/ML Workloads

Odin® protocol-agnostic optical engines enable new AI/ML architectures optimized for AI/ML workloads that minimize total power, footprint, and power consumption in data centres
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Co-Packaged Optics (CPO) Applications in Data Centers

Odin® high-capacity optical engines enable new approaches for co-packaging nx100Gbps PAM4 optical I/O with Ethernet switch and AI/ML silicon in a single packaged assembly